We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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Designed for high-precision polishing of planar components such as optical glass, quartz, crystals, ceramics, silicon wafers, and sapphire substrates.
Equipped with an active drive wheel rotation mechanism, providing excellent self-rotation performance for workpieces during processing. An electric lifting system for the correction plate is available as an optional configuration.
1.Drive System: Active drive wheel mechanism enhances workpiece self-rotation for improved polishing uniformity.
2.Correction Plate: Optional electric lifting device for easier operation and surface correction.
| High-Precision Planar Ring Polisher (JRHP-120B/160B) Technical Specifications | ||
| Parameters/ Model | JRHP-120B | JRHP-160B |
| Plate Size (Granite) | Φ1200 mm | Φ1600 mm |
| Plate Surface Runout | ≤0.06mm | ≤0.06mm |
| Single-point Runout | ≤0.01mm | ≤0.01mm |
| Plate Speed | 0.1~4RPM | 0.1~4RPM |
| Active Wheel Speed | / | / |
| Dimensions | 1710*1710*1320(mm) | 2300*2100*1480(mm) |
| Workpiece Ring Size | Φ500×Φ400×50mm | Φ600×Φ500×60mm |
| Processing Range | ≤Φ400mm | ≤Φ500mm |
| Conditioning Plate Size | Φ650×60mm | Φ850×80mm |
| Caliper Travel Distance | 0~150mm | 0~200mm |
| Total Power | 4KW/380V | 4KW/380V |
| Weight | Approx 2200kg | Approx. 3500kg |
| Custom designs and modifications are available upon client request. | ||
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