Ultra-precision Dicing Machine Series

Machine Tool Overview

1.This machine is equipped with three high-precision linear guideways and an air-bearing grinding spindle to meet ultra-precision machining requirements.

2.To further ensure motion accuracy and machining stability of the guideways, the machine base is constructed from natural granite, effectively minimizing thermal deformation and environmental temperature influence.

3.In addition, the system is equipped with two high-magnification microscope lenses and a non-contact tool setting device, enabling real-time grinding wheel measurement and in-process product inspection.

4.The production capacity is approximately one 85 × 85 mm glass wafer per hour, or 250 pieces of 5 × 5 mm glass chips per hour.