We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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Designed for precision grinding and polishing of spherical and planar surfaces of optical glass, fused quartz, crystal materials, electronic components, and other precision materials. It is also ideal for the grinding and polishing of high-precision flat, concave, and convex molds.
The machine is available with either a touchscreen HMI or a rotary-knob control interface, allowing users to select the operating mode that best suits their production requirements.
| Technical Specifications | ||
| Parameters /Model | JRQM 15-4 | JRQM 10-6 |
| Workpiece Diameter | ≤Φ150 mm | ≤Φ100 mm |
| Spindle Space | 400mm | 300mm |
| Spindle Accuracy | ≤0.02mm | ≤0.02mm |
| Spindle Speed | 0,280~1400 RPM | 0,280~1400 RPM |
| Number of Spindles | 4 Spindles , Thread M22x2.5 ( Positioning circle Φ24 ) | 6 Spindles , Thread M22x2.5 ( Positioning circle Φ24 ) |
| Air Pressure | 0.6 MPa | 0.6 MPa |
| Oscillation Freq. | 45strokes/min (fixed speed) | 45strokes/min (fixed speed) |
| Dimensions | 1920*1120*1750(mm) | 2050*1120*1750(mm) |
| Total Power | 4.8KW/380V | 7.2KW/380V |
| Weight | Approx. 1100kg | Approx. 1400kg |
| Custom designs and modifications are available upon client request. | ||
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