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We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing

JRXM-75 Precision Rotary Surface Grinder

Application

Designed for high-precision surface milling and grinding of optical glass, quartz, sapphire, ceramics, silicon wafers, precision molds, and other hard & brittle materials.

Widely used in optics, semiconductor, electronics, and precision mechanical industries for high-flatness planar processing.


Technical Specifications
Machining Capacity
ItemSpecification
Allowable Range of Workpiece DiameterΦ750 mm
Allowable Range of Workpiece ThicknessMax. 185 mm (Distance from lower end of grinding wheel to worktable surface)
Grinding Wheel Assembly
ItemSpecification
Grinding Wheel ShapeCup-Shape Grinding Wheel
Grinding Wheel DiameterΦ400 mm
Grinding Wheel Speed1445 rpm (50 Hz)
Peripheral SpeedApprox. 30 m/s (50 Hz)
Grinding Head Section
ItemSpecification
Max. Vertical Travel210 mm
Rapid Up/Down SpeedApprox. 75 mm/min (50 Hz)
Fine Feed Speed0.005 – 0.48 mm/min
Feed per Handwheel RevolutionApprox. 0.2 mm
Feed per Handwheel GraduationApprox. 0.002 mm
Worktable Section
ItemSpecification
Worktable DiameterΦ750 mm
Worktable Rotation SpeedVariable Speed 1 – 22 rpm (60 Hz)
Reduction Ratio1:30
Lubrication ModePeriodic Oil Filling
Magnetic Chuck Section
ItemSpecification
Electromagnetic Chuck DiameterΦ750 mm (Center Φ100 Non-magnetic Zone)
Magnetic Pole PitchWide Pole 4 + 12
Magnetic Holding Force10 kg/cm²
Motor Power
ItemSpecification
Spindle Motor (with Inverter)11 kW, 6P
Rapid Lift Motor0.25 kW, 4P
Feed Servo Motor0.75 kW
Feed Lift Reducer1:40
Worktable Drive Motor (with Inverter)2.2 kW, 4P
Worktable Reducer1:30
Coolant Pump Motor0.45 kW
Total Installed PowerApprox. 13 kW
Electrical System
ItemSpecification
Input Power Supply380 V / 50 Hz
Control Circuit Voltage220 V / 50 Hz
Electric Control CabinetMounted on lower part of machine body
HMI Touch Panel10.2 inch touch screen
Other OptionsConfirmed by mutual negotiation
Machine Dimensions
ItemSpecification
Weight4000 kg
Dimensions (L × W × H)1950 × 1150 × 2450 mm
Coolant Tank Dimensions (L × W × H)1200 × 610 × 600 mm (with wheels)
Coolant Tank Capacity280 L
Required Floor Space2000 × 2000 mm


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Machining Capacity
ItemSpecification
Allowable Range of Workpiece DiameterΦ750 mm
Allowable Range of Workpiece ThicknessMax. 185 mm (Distance from lower end of grinding wheel to worktable surface)
Grinding Wheel Assembly
ItemSpecification
Grinding Wheel ShapeCup-Shape Grinding Wheel
Grinding Wheel DiameterΦ400 mm
Grinding Wheel Speed1445 rpm (50 Hz)
Peripheral SpeedApprox. 30 m/s (50 Hz)
Grinding Head Section
ItemSpecification
Max. Vertical Travel210 mm
Rapid Up/Down SpeedApprox. 75 mm/min (50 Hz)
Fine Feed Speed0.005 – 0.48 mm/min
Feed per Handwheel RevolutionApprox. 0.2 mm
Feed per Handwheel GraduationApprox. 0.002 mm
Worktable Section
ItemSpecification
Worktable DiameterΦ750 mm
Worktable Rotation SpeedVariable Speed 1 – 22 rpm (60 Hz)
Reduction Ratio1:30
Lubrication ModePeriodic Oil Filling
Magnetic Chuck Section
ItemSpecification
Electromagnetic Chuck DiameterΦ750 mm (Center Φ100 Non-magnetic Zone)
Magnetic Pole PitchWide Pole 4 + 12
Magnetic Holding Force10 kg/cm²
Motor Power
ItemSpecification
Spindle Motor (with Inverter)11 kW, 6P
Rapid Lift Motor0.25 kW, 4P
Feed Servo Motor0.75 kW
Feed Lift Reducer1:40
Worktable Drive Motor (with Inverter)2.2 kW, 4P
Worktable Reducer1:30
Coolant Pump Motor0.45 kW
Total Installed PowerApprox. 13 kW
Electrical System
ItemSpecification
Input Power Supply380 V / 50 Hz
Control Circuit Voltage220 V / 50 Hz
Electric Control CabinetMounted on lower part of machine body
HMI Touch Panel10.2 inch touch screen
Other OptionsConfirmed by mutual negotiation
Machine Dimensions
ItemSpecification
Weight4000 kg
Dimensions (L × W × H)1950 × 1150 × 2450 mm
Coolant Tank Dimensions (L × W × H)1200 × 610 × 600 mm (with wheels)
Coolant Tank Capacity280 L
Required Floor Space2000 × 2000 mm


Ji Rui Technology (Guangxi) Co., Ltd.
Ji Rui Technology is a high-tech enterprise specializing in high-end intelligent equipment for precision optics and semiconductors, providing one-stop full-chain process solutions integrating R&D, manufacturing, and global supply.
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