We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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Mainly used for the rough grinding, fine grinding, and polishing of planar (flat), concave/convex spherical, and aspherical surfaces.
| JRYG-50 Single-Spindle Grinding & Polishing Machine Technical Specifications | |
| Item | Specification |
| Spindle Parameters | 1-spindle, M27×3 Thread, Taper 1:8 |
| Max Plate Diameter | Φ500mm |
| Spindle Accuracy | ≤0.02mm |
| Spindle Speed | 0, 100~500RPM |
| Total Power | 1.6KW/380V |
| Weight | Approx. 250kg |
| Dimensions(L×W×H) | 1150*1150*1100(mm) |
| Custom designs and modifications are available upon client request. | |
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