We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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Designed for high-precision grinding and polishing of planar (flat) and spherical surfaces of optical glass, quartz, crystals, and precision electronic components.
1.Motion Control: Supports swing-arm motion. Spindle speed, oscillation (stroke/frequency), pressure, and processing time can be independently adjusted based on specific workpiece requirements.
2.Motion Modes:
Type A: Planar Swing Motion (Sweep).
Type B/C: Elliptical Motion.
3.Interface: Available with either Touchscreen HMI or Rotary Knobs.
| JRGP35-4 Four-Spindles High-Speed Grinding and Polishing Machine Technical Specifications | |||
| Workpiece Diameter | ≤Φ350mm | Spindle Spacing | 550mm |
| Spindle Speed | 0, 70~350RPM | No. of Spindles | 4 Spindles (M27×3 Thread) |
| Spindle Accuracy | ≤0.02mm | Oscillation Freq. | 0.10~50 strokes/min |
| Oscillation Stroke | 0~140mm | ||
| Air Pressure | 0.6MPa | Total Power | 4.8KW/380V |
| Dimensions | 2350*1250*1650(mm) | Weight | Approx. 1100 kg |
| Custom designs and modifications are available upon client request. | |||
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