We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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This machine is specifically designed for high-precision double-sided grinding and polishing of hard and brittle materials, including semiconductors, sapphire, optical glass, fused quartz, technical ceramics, and metals.
The machine frame is manufactured from high-quality cast and forged components, providing excellent rigidity and long-term operational stability. Key precision components are sourced from internationally recognized brands to ensure consistently high polishing quality, reliable performance, and extended equipment service life.
Featuring a user-friendly operating interface, the machine enables convenient parameter configuration and seamless switching between different processing modes. A wide range of models with various working sizes and power configurations is available to meet diverse production requirements and application needs.
| Categories | Item | JRSM-22B | JRSM-24B | JRSM-32B |
| Lapping machine | Plate size(mm) | Φ 1465*Φ 497*50 | Φ 1580*Φ 562*60 | Φ 2145*Φ 735*70 |
| Max processing size(mm) | Φ 470 | Φ 550 | Φ 700 | |
| Polishing machine | Plate size(mm) | Φ 1495*Φ 467*50 | Φ 1646*Φ 496*60 | Φ 2200*Φ 680*70 |
| Max processing size(mm) | Φ 470 | Φ 550 | Φ 700 | |
| Carrier parameter | Number | 5 | 5 | 5 |
| Tooth number(Metric system) | 138 | 152 | 270 | |
| Modulo (Metric system) | 4 | 4 | 3 | |
| Driving system | Motor 1 | / | / | / |
| Motor 2 | / | / | / | |
| Motor 3 | / | / | / | |
| Motor 4 | 43.2 KW | 43.2 KW | 54.5 KW | |
| Processing Capabilities | 100mm | 75 | / | / |
| 125mm | 40 | / | / | |
| 150mm | 30 | 40 | / | |
| 200mm | 20 | 25 | / | |
| 300mm | / | / | 20 | |
| Power voltage | / | 3*16+2*6 (mm²) | 3*16+2*6 (mm²) | 3*25+2*6 (mm²) |
| Compressed air supply | / | 0.5-0.6MPa | 0.5-0.6MPa | 0.5-0.6MPa |
| Dimensions (L*W*H) | / | 2950*1890*3210mm | 2950*1890*3210mm | 3500*3900*4030mm |
| Weight | / | Approx 8.5T | Approx 10T | Approx 28T |
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桂公网安备45010802001172号