We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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This machine is specifically designed for high-precision double-sided grinding and polishing of hard and brittle materials, including semiconductors, sapphire, optical glass, fused quartz, technical ceramics, and metals.
The machine frame is manufactured from high-quality cast and forged components, providing excellent rigidity and long-term operational stability. Key precision components are sourced from internationally recognized brands to ensure consistently high polishing quality, reliable performance, and extended equipment service life.
Featuring a user-friendly operating interface, the machine enables convenient parameter configuration and seamless switching between different processing modes. A wide range of models with various working sizes and power configurations is available to meet diverse production requirements and application needs.
| Categories | Item | JRSM-16B | JRSM-18B | JRSM-20B |
| Lapping machine | Plate size(mm) | Φ 1112*Φ380*50 | Φ 1230*Φ426*50 | Φ 1355*Φ458*50 |
| Max processing size(mm) | Φ 340 | Φ 390 | Φ 420 | |
| Polishing machine | Plate size(mm) | Φ1149*Φ343*50 | Φ 1253*Φ403*50 | Φ 1380*Φ433*50 |
| Max processing size(mm) | Φ 340 | Φ 390 | Φ 420 | |
| Carrier parameter | Number | 5 | 5 | 5 |
| Tooth number(Metric system) | 200 | / | / | |
| Modulo (Metric system) | DP12 | / | / | |
| Driving system | Motor 1 | / | / | / |
| Motor 2 | 12.5 KW | / | / | |
| Motor 3 | 15.45 KW | 15 KW | 25.45 KW | |
| Motor 4 | 22.7 KW | 28.8 KW | 35.7 KW | |
| Processing Capabilities | 75mm | 85 | 105 | 115 |
| 100mm | 40 | 55 | 60 | |
| 125mm | 25 | 25 | 45 | |
| 150mm | 20 | 5 | 30 | |
| Power voltage | / | 3*10+2*6 (mm²) | 3*10+2*6 (mm²) | 3*10+2*6 (mm²) |
| Compressed air supply | / | 0.5-0.6MPa | 0.5-0.6MPa | 0.5-0.6MPa |
| Dimensions (L*W*H) | / | 2655*1680*2900mm | 2400*1800*2960mm | 2950*1890*3210mm |
| Weight | / | Approx. 5.5T | Approx. 8.0T | Approx. 8.0T |
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桂公网安备45010802001172号