We Make Ultra-Precision Equipment for Higher Efficiency in Optics & Semiconductors Manufacturing
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This machine is specifically designed for high-precision double-sided grinding and polishing of hard and brittle materials, including semiconductors, sapphire, optical glass, fused quartz, technical ceramics, and metals.
The machine frame is manufactured from high-quality cast and forged components, providing excellent rigidity and long-term operational stability. Key precision components are sourced from internationally recognized brands to ensure consistently high polishing quality, reliable performance, and extended equipment service life.
Featuring a user-friendly operating interface, the machine enables convenient parameter configuration and seamless switching between different processing modes. A wide range of models with various working sizes and power configurations is available to meet diverse production requirements and application needs.
| Categories | Item | JRSM-13B | JRSM-13.9B | JRSM-15B |
| Lapping machine | Plate size(mm) | Φ 927*Φ 358*45 | Φ 914*Φ534*50 | Φ 1024*Φ 412*50 |
| Max processing size(mm) | Φ 260 | Φ 180 | Φ 300 | |
| Polishing machine | Plate size(mm) | Φ 933*Φ 349*45 | Φ 933*Φ 515*50 | Φ 1041*Φ 395*50 |
| Max processing size(mm) | Φ 260 | Φ 180 | Φ 300 | |
| Carrier parameter | Number | 6 | 9 | 6 |
| Tooth number(Metric system) | 147 | 108 | 162 | |
| Modulo (Metric system) | DP12 | DP12 | DP12 | |
| Driving system | Motor 1 | 7.5 KW | 7.5 KW | / |
| Motor 2 | 9 KW | 9 KW | 13.2 KW | |
| Motor 3 | 10.5 KW | 10.5 KW | / | |
| Motor 4 | 11.75 KW | 11.75 KW | / | |
| Processing Capabilities | 50mm | / | 72 | 126 |
| 75mm | 48 | 36 | 72 | |
| 100mm | 30 | 18 | 42 | |
| 125mm | 18 | / | 24 | |
| Power voltage | / | 3*6+2*4 (mm²) | 3*6+2*4 (mm²) | 3*6+2*4 (mm²) |
| Compressed air supply | / | 0.4-0.5MPa | 0.4-0.5MPa | 0.4-0.5MPa |
| Dimensions (L*W*H) | / | 1820*1100*2820mm | 1820*1100*2820mm | 1900*1400*2700mm |
| Weight | / | Approx. 3.0T | Approx. 3.0T | Approx. 4.0T |
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jrtech_mandy
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